In the fourth quarter of 2024, the Jiangsu factory made significant breakthroughs in technological innovation, obtaining five invention patents, which fully demonstrated its strong R&D capabilities in the PCB manufacturing field.

The five invention patents are respectively: CN118175742B - A Fabrication Process for Solving Slot Short Circuit of BOC Carrier Boards, CN118250937B - A Manufacturing Process of Arbitrary Layer Interconnected Printed Circuit Boards, CN118338548B - A Fabrication Process of Ultra-Small Pitch Gold Fingers for Circuit Boards Based on Embedded Wire Structure, CN118450611B - A Method for Solving Hole Damage of Positioning Holes in HDI Boards during Forming, CN118555763B - A Fabrication Method of Blind Hole Electroplating with High Dielectric Thickness and Large Aperture.

Among them, CN118175742B, a manufacturing process for resolving the slot short circuit of BOC carrier boards, and CN118338548B, a manufacturing process for ultra-small pitch gold fingers of circuit boards based on the embedded wire structure, are the outcomes of the Industry-University-Research cooperation between our company and the University of Electronic Science and Technology of China. The company integrates the superior resources of both the university and the enterprise, expedites the transformation of scientific and technological achievements, and injects vigorous impetus into technological upgrading and product innovation.

The five invention patents center on the core aspects of printed circuit board manufacturing. Ranging from addressing the short circuit issue of BOC carrier board slotting to the fabrication of arbitrary layer interconnected printed circuit boards, from the manufacturing process of ultra-small pitch gold fingers to the handling of hole damage in positioning holes of HDI boards, and to the electroplating method for blind holes with high dielectric thickness and large aperture, they comprehensively cover the critical technical pain points in the industry, offering innovative solutions for high-quality circuit board production. Among them, the two patents jointly developed with the University of Electronic Science and Technology of China are particularly notable, showcasing the immense potential and boundless possibilities of university-enterprise collaboration in conquering technical difficulties and accelerating the transformation of scientific and technological achievements.

We will persist in adhering to the innovation-driven development strategy, intensify the input of R&D resources, broaden the boundaries of Industry-University-Research cooperation, empower products through technology, guide the future with innovation, and continuously propel the PCB industry towards a new stage of higher quality and greater innovativeness.